ASME Summer Heat Transfer Conference 2026
Modelon simulation expert Nithish Selvan will serve as an invited panelist in the Panel on Fundamentals of Data Center and Contemporary Semiconductor Thermal Management at the 2026 Summer Heat Transfer Conference sponsored by the American Society of Mechanical Engineers (ASME).
The panel will include a discussion bridging fundamental research and real-world deployment across:
- High-power xPUs and next-gen processor thermal loads (~700–2000 W)
- Chip-level hot spot mitigation in advanced device layers and interfaces
- Direct-to-chip cooling (single-/two-phase liquid), including cold plates and CDUs
- Systems & sustainability: data center/building-level thermal management, refresh cycles, and waste-heat recovery opportunities
Learn more about the conference by visiting the website and reach out to Nithish if you plan to attend.